Profit & Environment
Profitable environmental consciousness
Sustainability and environmental consciousness are becoming even stronger competitive factors and are key to a continuous, long-term business development. The synergies between profit and environment have never been more important. This is why we continue to innovate, develop and adapt new technologies to ensure that state-of-the-art product quality resonates with UN´s sustainability goals. We are convinced that our ongoing commitment to implementing our process in the market at a steady pace will demonstrate the impact of our efforts on the bottom line. Both environmentally and financially, for our customers as well as for ourselves.
Our unique and patented Dry Phase Patterning technology enables environmentally friendly, cost-efficient production of flexible electric circuit boards. Replacing hazardous traditional chemical etching processes by sub-suppliers in distant countries with an in-house, mechanical reel-to-reel process. Not only do our customers experience great cost savings, the new lifecycle impact of their products are also drastically decreased. This is both a game-changing solution for sustainability and allows for local high-quality production, being customizable. This simplifies the production process by cutting lead times as well as significantly reducing international transports, waste management and costs.
The Dry Phase Patterning technology can use several various types of flex foil materials for example Al (aluminum), Cu (copper) or (CCA) Copper Cladded Aluminum as top layer. The CCA´s innovative approach not only provides cost advantages by leveraging the connectivity of copper and the affordability of aluminum but also aligns with our commitment to balance profit and environment. This results in a very attractive total cost of ownership.
If you are interested to do a cost evaluation for the production costs of your product/s, please contact us.
Curious to see your global impact?
Before exploring the interactive chart below, note that these calculations are based on a specific scenario. Depending on the design of your flexible printed circuit boards (FPCBs), the numbers may vary. For this comparison, following design parameters are assumed:
- For copper as conductor, the thickness of the layer is 35 μm.
- For aluminum as conductor, the thickness of the layer is 18 μm.
- The carrier substrate (PI/PET) has a thickness of 50 μm for both scenarios.