The DPP method allows you to produce conducting structures on flexible materials like metals, paper, or plastic, using a principle basically as simple as punching a hole in a paper – almost. To put it short, a cliché presses out your desired pattern on a material, or “web”, consisting of a conducting top layer and a dielectric bottom carrier. A milling wheel then mechanically removes the protruding pattern from the top layer (the pattern layer), while the bottom carrier remains untouched. This leaves a conductive pattern on the laminate. This patented process brings you instant advantages, such as increased cost efficiency, reduced lead times, and environmentally friendly, sustainable production. Not to mention the safety aspects – the smooth integration in your current production line means you can keep all the intellectual property in-house.

Our technology can also be used for non-electronic and non-conductive applications, such as plastic or paper decor, or functional 3D structures, like micro-fluid channels or cavities for leveling electronic components.

With the DPP technology you can use various types of organic material as the carrier, such as PET (Polyethylene terephthalate), PC (Polycarbonate), PI (Polyimide) or PEN (Polyethylene naphtalate). Depending on desired thickness and end result, use Al (aluminum), Cu (copper) or (CCA) Copper Cladded Aluminum as top layer. The chart below shows typical values for the different alternatives.

Material structure

AL Cu CCA
Carrier PET, PC, PI, PEN PET, PC, PI, PEN PET, PC, PI, PEN
Carrier Thickness 35µ - 75µ 35µ - 75µ 35µ - 75µ
Conductor Thickness 9 µ - 40µ 10µ Al: 9µ-30µ Cu: 150 nm

Design guide

AL Cu CCA
Spacing 100 µ 150 µ 100 µ
Pitch 400 µ 500 µ 400 µ
Best Accuracy 10 µ 10 µ 10 µ
Technology