LOPEC Exhibition March 1–2, 2023 | Trade Fair Center Messe München
DP Patterning is exhibiting at LOPEC Exhibition 2023 in Munich! We will present how your company can cut costs and improve sustainability for Flexible PCB production with the globally unique Dry Phase Patterning technique.
LOPEC— is the world’s leading international platform in the field of flexible and printed electronics. We are exhibiting at Booth 407 in the Exhibition area.
This year we will be Co-exhibitor in a Swedish Printed and Flexible Electronics Pavillion led by Norrköping Science Park who are arranging a common booth for several Swedish companies. Here you will find DP Patterning together with the following companies, LIGNA ENERGY, Cellfion, n-ink, Ynvisible, and Redox.me. View the hall plan.
Dry Phase Patterning and Avery Dennison collaboration at LOPEC!
The DP Patterning participation in LOPEC 2023 is truly a collaborative effort. We are not only exhibiting with others, but we are also participating together with Avery Dennison Hanita in the LOPEC 2023 Poster Session, to highlight the combination of Avery Dennison “Copper Skin” flex foil in combination with the Dry Phase Patterning process and how this open up for new possibilities in novel applications. Examples of suitable applications include flexible electronics, PV back sheets, EV batteries, antennas and more. Please meet with our R&D Manager Roman Armgarth at the Poster Session on March 1, from 18:00 to 19:30 to discuss and share your thoughts.
Together with Avery Dennison Hanita we also participate in the LOPEC “OE-A Competition 2023” – showing the beauty of simplicity with the eco-friendly, ultra- thin and flexible heating foil, based on Avery Dennison Hanita copper skin film, that have been produced to a heater in our Dry Phase Patterning system. You can find our contribution at the LOPEC Innovation Showcase, booth 306.
DP Patterning offers an innovative solution to revolutionize flexible circuit board manufacturing. Our globally unique Dry Phase Patterning technique allows for producers of electronics to bring the production of flexible circuit boards in-house, integrated with final assembly, instead of relying on sub-suppliers.
Replacing hazardous traditional chemical etching processes in distant countries with a versatile mechanical reel-to-reel process, this cost-efficient and game-changing solution enables efficient sustainable production. It is customizable and simplifies the production process by cutting lead times as well as significantly reducing transports and waste management.
Today, we support manufacturers and front-runners in the automotive and RFID sectors, while continuously researching and developing new system solutions to individual customer requirements.
At LOPEC we will showcase our latest upgrade of the DPP 360 system – The new ultra fine cleaning module – that let you create new designs for higher voltages and fine structures. Below you can enjoy the video presentation of the new cleaning module made by our CEO and founder, Staffan Nordlinder.
For individual meetings and discussions, please connect with Tommy Höglund, Sales & Marketing Manager.
Mobile: +46 72 245 46 74